Engineering Napkin Scribbles to Production Designs
ENVIROMENTS
High Reliability, Harsh Enviroment
This design incorporates Flex-Circuit between the connectors and PC Board. The design also shows Metal-Backed Daughter Cards that provide excellent thermal transfer to the box.
Heavy Vehicle Environment
This design incorporates PC Board connecting to Metal-Backed boards via headers and pins. The "Hot" components are placed on the Metal-Backed Board for excellent heat transfer to heatsink walls of the box that allowed forced air flow for cooling.
Commercial Vehicle Enviroment
Designed for a Vehicle environment, this design incorporates daughter cards to help mitigate component scarcity. Daughter cards may be changed to allow a larger IC chip selection for power and processor supply issues.
Commercial Grade
These designs are for non-harsh environments but were designed to high reliability and high volume concerns.
Harsh Space Environment
Design for harsh Space Environment using radiation harden components, utilizing a standard form-factor PCB size that installs into a box with a Backplane Board. These designs reflect high concerns to vibration and EMI/EMC concerns, as well as acceptable thermal operation window.
